With a 1.3(5.0) million pixel CMOS sensor, the image is more clear, can support a smaller target disk, greatly reducing the weight of the target disk.

With the Ti Da Vinci (DaVinci) high performance video processing DSP and large capacity high-speed DDR2 cache, the image signal were high-speed processing, directly to complete the target disk identification and spatial location calculation, greatly reduce the CPU load.

The camera is fully intelligent, embedded 3D positioning software module, the direct output of the space coordinates of the wheel. Full support for SDK two development, greatly reduce the difficulty of the four round of positioning software development.

The camera is highly integrated, the main chip using BGA and QFN package, chip pin inside the tube, using the placement machine welding. Improve oxidation resistance, reliability, service life extended 2 times, greatly reduce the after-sales service.